Mount and through-hole principles which are usually incorporated into theĮnd Item Documentation IPC-D-325 Documentation depicting bare board specific end product requirementsĭesigned by the customer or end item assembly requirements. Land patterns for surface mount and the assembly concentrates on surface
The following topics are addressed in this section:ĭesign requirements reflecting three levels of complexity (Levels A, B, andĬ) indicating finer geometries, greater densities, more process steps toĬomponent and Assembly Process Guidelines to assist in the design of theīare board and the assembly where the bare board processes concentrate on AnyĬopying, scanning or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited andĬonstitutes infringement under the Copyright Law of the United States.Ĭlause number changes as a result of reorganizing within this chapter are not shown. All rights reserved under both international and Pan-American copyright conventions. Deleted or moved text is shown in red and strikethrough like this. New or changed text are shown in blue and underlined like this. IPC-A-610E This redline document is to help users see significant changes from Revision D.
